Design of a High Heat Consumption Airborne Electronic Equipment
Abstract
A structural design of airborne electronic equipment with a total heat consumption of 1205 W and a maximum heat consumption of
105 W for a LRM, which includes 26 functional modules (LRMs) and complicated interconnection among internal LRMs, is introduced. The
overall structure and characteristics of the electronic equipment and the design scheme of the liquid cooling system are described in detail.
The design scheme has been validated in a certain project to meet the requirements of GJB150A-2009. It has been proved that the equipment
has compact structure, reasonable heat dissipation and better mechanical properties. A structural design for similar equipment is provided.
105 W for a LRM, which includes 26 functional modules (LRMs) and complicated interconnection among internal LRMs, is introduced. The
overall structure and characteristics of the electronic equipment and the design scheme of the liquid cooling system are described in detail.
The design scheme has been validated in a certain project to meet the requirements of GJB150A-2009. It has been proved that the equipment
has compact structure, reasonable heat dissipation and better mechanical properties. A structural design for similar equipment is provided.
Keywords
Electronic equipment; Liquid cooling system; Cold plate; Structural design
Full Text:
PDFReferences
[1] Faliang Ye, F.: Thermal Design of Airborne Liquid Cooler Frame Based on ASAC Standard Module. Journal 30(5), 7-12 (2014).
[2] Wei Wu, F.: Design of Multi-Layer Liquid Cooling Frame Based on Hose. Journal 30(1), 127-129 (2017).
DOI: http://dx.doi.org/10.70711/aitr.v3i5.8355
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