Design of Biomimetic Vascular Structure Microchannel Cold Plate and Its Enhanced Heat Transfer Performance in Electronic Device Heat Dissipation
Abstract
a fourth-order branching biomimetic structure (Scheme C). A detailed analysis was conducted on the fl ow fi eld characteristics, temperature
distribution, pressure drop and fl ow resistance, and overall performance of the three schemes by establishing a three-dimensional geometric
model, performing mesh partitioning and independence verifi cation, setting mathematical models and assumptions, and applying boundary
conditions. The results indicate that the four-level branching biomimetic structure (Scheme C) outperforms other schemes in improving fl ow
uniformity, reducing maximum wall temperature, and decreasing fl ow resistance. It has the highest comprehensive performance factor (PEC)
and is suitable for high heat fl ux density cooling applications.
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[1] Yin Huibin, a high school farmer Current Status and Progress of Heat Dissipation Technology for Electronic Devices [J]. Guangdong
Chemical Industry, 2013, 40 (04): 67-68.
[2] Tang Hao Characteristics of Microchannel Heat Dissipation Interface in Copper Liquid Cold Plate and Its Influence on Cold Plate Performance [D]. Chongqing: Chongqing University, 2023.
[3] Yin Huibin, a high school farmer Current Status and Progress of Heat Dissipation Technology for Electronic Devices [J]. Guangdong
Chemical Industry, 2013, 40 (4): 67-68.
DOI: http://dx.doi.org/10.70711/frim.v3i12.7886
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