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Research on Wafer Reference Mark Recognition Method Based on Lightweight Improved YOLOv5

Xinfei Zhao

Abstract


Aiming at the problems of grayscale shift and edge blur caused by process fluctuations in wafer reference marks during semiconductor manufacturing, traditional image recognition methods such as template matching and edge detection have poor robustness and can
hardly meet the requirements of precision positioning. This paper proposes a lightweight method based on YOLOv5s and structured pruning, which achieves the balance between model compression and accuracy through simulated degraded data, transfer learning and structured pruning. Experimental results show that the proposed method effectively reduces the model parameters and computational cost while
maintaining high-precision recognition performance, has significant advantages in degraded scenarios, and can be efficiently deployed on
ordinary CPU devices.

Keywords


Wafer Reference Mark; YOLOv5; Lightweight; Structured Pruning; Small Object Detection

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References


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[3] Cao Y Y. Research on wafer surface defect detection system based on deep learning[D]. North China University of Water Resources and

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[4] Hu W, Zhao J M, Li D A. Lightweight laser chip defect detection algorithm based on improved YOLOv7-Tiny[J]. Journal of Taiyuan

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DOI: http://dx.doi.org/10.70711/frim.v4i5.9373

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